Brief: Suncorp Technologies says indirect unit entered loan agreement
03/02/2016 14:46
Feb 3 (Reuters) - Suncorp Technologies Ltd 1063.HK : * Disclosable transaction provision of loan 1063.HK * Lender, an indirect wholly-owned subsidiary of the company, has entered into the loan agreement with the borrower * Loan of HK$100 million * Lender will finance the loan with the company's fund from the placing that was completed on 13 April 2015 * Source text for Eikon ID:nHKSc7VV9C ((For more news, please click here 1063.HK )) ((Bengaluru Newsroom; +91 80 6749 1130))
Recent news on Suncorp Technologies
See all newsBrief: Suncorp Technologies FY Revenue Hk$50.3 Million
Brief: Suncorp Technologies Expects Profit Of HK$30 Million For Year
Brief: Suncorp Technologies Expects HY Net Profit Of HK$21 Million
Brief: Suncorp Technologies Expects HK$46 Million Loss For Year
Brief: Suncorp Technologies Enters Memorandum Of Understanding On Strategic Partnership