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    Brief: Globalfoundries Reaches Agreement To Establish U.S.-Based Supply Of Silicon Interposers For Advanced Ai Packaging

    Picture of Taiwan Semiconductor Manufacturing logoTaiwan Semiconductor Manufacturing
    08/10/2026 13:21
    BRIEF-Globalfoundries Reaches Agreement To Establish U.S.-Based Supply Of Silicon Interposers For Advanced Ai Packaging
    Oct 8 (Reuters) - GLOBALFOUNDRIES Inc. GFS.O:
    • GLOBALFOUNDRIES REACHES AGREEMENT TO ESTABLISH U.S.-BASED SUPPLY OF SILICON INTERPOSERS FOR ADVANCED AI PACKAGING
    • GLOBALFOUNDRIES - ANNOUNCES MANUFACTURING AGREEMENT WITH TSMC FOR U.S. SILICON INTERPOSERS
    • GLOBALFOUNDRIES - VOLUME PRODUCTION AT MALTA SITE EXPECTED TO BEGIN RAMPING IN FIRST HALF OF 2028
    • GLOBALFOUNDRIES - CO AND TSMC AGREEMENT HAS INITIAL TERM OF FIVE YEARS
    Source text: ID:nGNXbjG9HQ
    Further company coverage: GFS.O

     ((Reuters.Briefs@thomsonreuters.com;))

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