Brief: Telefonica Issues AUD 700 Mln Bonds In Australian Market
23/06/2026 12:41
BRIEF-Telefonica Issues AUD 700 Mln Bonds In Australian Market June 23 (Reuters) - Telefonica SA TEF.MC:
TELEFÓNICA ISSUES AUD 700 MILLION BONDS IN AUSTRALIAN MARKET
ISSUES AUD 300 MILLION BONDS DUE JUNE 30, 2032 WITH 5.962% COUPON
ISSUES AUD 400 MILLION BONDS DUE JUNE 30, 2036 WITH 6.552% COUPON
SETTLEMENT SCHEDULED FOR JUNE 30, 2026; LISTING TO BE SOUGHT ON ASX
ISSUANCE THROUGH SUBSIDIARY TELEFONICA EMISIONES
Source text: ID:nCNM91h8W2
Further company coverage: TEF.MC
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