Brief: Turk Telekomunikasyon Applies To Capital Markets Board For Bond Issue Up To $500 Million For Oversea Investors
March 8 (Reuters) - Turk Telekomunikasyon AS TTKOM.IS :
* TURK TELEKOMUNIKASYON AS APPLIES TO CAPITAL MARKETS BOARD
FOR
BOND ISSUE UP USD 500 MILLION FOR OVERSEA INVESTORS
Source text for Eikon: ID:nIKA45DWmG
Further company coverage: TTKOM.IS
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