Brief: UMC Has Raised T$4.8 Billion Via Unsecured Bonds

United Microelectronics

26/11/2025 06:41

Nov 26 (Reuters) - United Microelectronics Corp 2303.TW:

HAVE RAISED T$4.8 BILLION ($152.9 MLN) VIA UNSECURED BONDS

HAVE PRICED THE 3-YEAR TRANCHE OF THE BONDS AT T$2.3 BILLION, WITH A YIELD OF 1.55%

HAVE PRICED THE 5-YEAR TRANCHE OF THE BONDS AT T$2.5 BILLION, WITH A YIELD OF 1.60%

Source text: ID:nMOP3Wnqgb

Further company coverage: 2303.TW

 (Reporting by Faith Hung)

 ((faith.hung@thomsonreuters.com;))