Brief: UMC Says Issues T$10 Bln Of Unsecured Bond, Sets Yield Of 1.62%
06/09/2023 09:36
Sept 6 (Reuters) - United Microelectronics Corp
2303.TW :
* SAYS ISSUES T$10 BILLION ($312.5 MLN) OF UNSECURED
CORPORATE
BOND, SETS YIELD OF 1.62%
Source text for Eikon: ID:nMOPbcFgF0
Further company coverage: 2303.TW
(Reporting by Faith Hung)
((faith.hung@thomsonreuters.com;))
Recent news on United Microelectronics
See all newsTaiwan's UMC prices $1.8 billion convertible bond sale (updated)
Taiwan's UMC plans convertible bond sales to raise $1.8 billion, term sheet shows
Brief: UMC Acquires Machinery Equipment For T$6.98 Billion
Brief: UMC Board Approves Plan To Raise Up To $1.8 Billion Via Overseas Unsecured Convertible Bonds
Taiwan's UMC raises 2026 capex, expands Singapore and Taiwan fabs for AI demand (updated)