Brief: Umc Says Signs T$1.4 Bln Contract For Leasing Land To Build Fab 12I P3
30/03/2023 07:58
March 30 (Reuters) - United Microelectronics Corp
2303.TW :
* SAYS SIGNS T$1.4 BILLION CONTRACT FOR LEASING LAND TO
BUILD FAB
12I P3
* SAYS SIGNS THE CONTRACT WITH L&K ENGINEERING CO.'S UNIT IN
SINGPAPORE
Source text for Eikon: ID:nMOP1T2VyP
Further company coverage: 2303.TW
(Reporting by Faith Hung)
((faith.hung@thomsonreuters.com;))
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