RCS - Versarien PLC - Appointment of Mouser in Global Distribution Deal <Origin Href="QuoteRef">VRS.L</Origin>

VersarienAnnouncement

15/07/2015 13:36

RNS Number : 6442K
Versarien PLC
20 April 2015

20 April 2015
Versarien plc
("Versarien" or the "Company")
Versarien Technologies appoints Mouser in global distribution deal
Versarien Technologies Limited, the Company's subsidiary which specialises in advanced thermal management solutions, has appointed Mouser Electronics Inc as an authorised global distributor. Under the agreement, Mouser will sell and promote the Versarien standard range of heat sink products based upon the VersarienCu micro-porous metallic copper foam technology.
The appointment of Mouser is Versarien's first major product distribution agreement with a US based company.
The heat sinks to be distributed by Mouser are Versarien Technologies' latest product range, launched earlier this month. The enhanced surface area of the foam, coupled with the exceptional thermal properties of copper, mean that the heat sink range is smaller in size without compromising performance, making it ideal for space constrained applications.
Neill Ricketts, CEO of Versarien, said: "Mouser Electronics have established a global reputation for offering the very latest components for designers of the next generation of all types of electronic devices. This significant distribution partnership marks another milestone in the commercialisation of our disruptive technology. It is also noteworthy by being our first overseas deal and we are extremely pleased that Mouser has chosen to sell our VersarienCu products across their global network."
For further information:
Versarien Plc
Neill Ricketts, Chief Executive Officer
Chris Leigh, Chief Financial Officer
Tel: +44 (0) 1594 888 622
www.versarien.com
Charles Stanley Securities
(Nominated Adviser and Broker) 
Russell Cook / James Greenwood
Tel: +44 (0) 20 7149 6000
IFC Advisory
(Financial PR and IR)
Tim Metcalfe / Graham Herring
Tel +44 (0)20 3053 8671
Notes to editors
Versarien plc (AIM:VRS), is an advanced engineering materials group. Leveraging proprietary technology, the Group creates innovative engineering solutions for its clients in a diverse range of industries. Versarien has three subsidiaries: 
Versarien Technologies Ltd. which owns the exclusive rights to a patent-protected additive process for creating advanced micro-porous metals targeting the thermal management industry and manufactures extruded aluminium heat sinks for the electronics and computing industries.www.versarien-technologies.co.uk
Total Carbide Ltd, a leading manufacturer in sintered tungsten carbide for applications in arduous environments such as the oil and gas industry. www.totalcarbide.com
2-DTech Ltd., which specialises in the supply, characterisation and early stage development of graphene products. www.2-dtech.com
About the VersarienCU heat sink range
The low profile range is designed for use in passive cooling applications where space is at a premium and performance is crucial. VersarienCu heat sinks can potentially be used to cool any Integrated Circuit component, with applications including:
  Power integrated circuits, high temperature components and transistors
  Set top boxes, AP routers, cable modems and broadband
  Optical Networks and LED TV and flat panel displays 
VersarienCu reduces the potential size requirement of individual components due to increased thermal efficiency. Where space has traditionally been at a premium the metallic foam now allows for a reduced footprint. The increased thermal efficiency of the copper foam on the component can allow for a cooling fan to be removed from products, and has the additional major benefit of increasing the life of a component by reducing overheating. 
By producing a standard range of off-the-shelf products Versarien is offering this advanced cooling technology to customers at a more competitive price which, together with the improved thermal management capabilities has already resulted in significant interest from large scale users, who are looking for more reliability and functionality for their electronic components.
ENDS

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