Feb 3 (Reuters) - Topsil Semiconductor Materials A/S
TPSL.CO :
* To reach agreement with customer to release Topsil's
products for manufacture
* Following agreement, customer has agreed that Topsil may
commence shipping of replacement wafers and that Topsil can now
receive new orders from customer
* Expects to deliver first shipment of wafers to customer in
H1 2015
Source text for Eikon: ID:nCSE5GpH
Further company coverage: TPSL.CO
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Keywords: TOPSIL/BRIEF