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Brief: Topsil Semiconductor Materials to reach agreement with customer

Feb 3 (Reuters) - Topsil Semiconductor Materials A/S 
 TPSL.CO : 
    * To reach agreement with customer to release Topsil's 
products for manufacture 
    * Following agreement, customer has agreed that Topsil may 
commence shipping of replacement wafers and that Topsil can now 
receive new orders from customer 
    * Expects to deliver first shipment of wafers to customer in 
H1 2015 
 
Source text for Eikon:  ID:nCSE5GpH  
Further company coverage:  TPSL.CO  
 
 (Gdynia Newsroom) 
 ((gdynia.newsroom@thomsonreuters.com; +48 58 698 3920;)) 
 
Keywords: TOPSIL/BRIEF

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