Brief: Chinlink International To Place Bonds In Aggregate Principal Amount Of Up To HK$200 Mln
30/07/2019 14:31
July 30 (Reuters) - Chinlink International Holdings Ltd
0997.HK :
* TO PLACE BONDS IN AN AGGREGATE PRINCIPAL AMOUNT OF UP TO
HK$200
MILLION
Source text for Eikon: ID:nHKS93qNxn
Further company coverage: 0997.HK
((Reuters.Briefs@thomsonreuters.com;))
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