July 23 (Reuters) - Thin Film Electronics ASA THIN.OL :
* REG-THIN FILM ELECTRONICS ASA HAS SECURED ADDITIONAL
FUNDING BY
WAY OF A COMMITTED PRIVATE PLACEMENT OF SHARES RAISING NOK 50
MILLION
* REG-THIN FILM ELECTRONICS ASA HAS SECURED ADDITIONAL
FUNDING BY
WAY OF A COMMITTED PRIVATE PLACEMENT OF SHARES RAISING NOK 50
MILLION
* THIN FILM ELECTRONICS ASA - HAS SECURED ADDITIONAL FUNDING
OF
NOK 50 MILLION BY A PRIVATE PLACEMENT OF SHARES TO FUND NEXT
PHASE OF COMPANY'S DEVELOPMENT AND COMMERCIALIZATION STRATEGY
* PRIVATE PLACEMENT IS SUBJECT TO SHAREHOLDER APPROVAL
* OFFERED AND COMMITTED SUBSCRIPTION PRICE PER SHARE IS NOK
0.15
* GIVEN FINANCIAL SITUATION OF COMPANY, BOARD WILL RECOMMEND
TO
COMPANY'S SHAREHOLDERS THAT OFFER BE APPROVED
* EGM IS EXPECTED TO BE HELD ON OR ABOUT 17 AUGUST 2020
* OFFER INVOLVES ISSUANCE OF 333,866,666 NEW SHARES AT A
SUBSCRIPTION PRICE PER SHARE OF NOK 0.15
* BOARD WILL ALSO PROPOSE TO UPCOMING EGM THAT A SUBSEQUENT
OFFERING IS CARRIED OUT AT A SUBSCRIPTION PRICE PER SHARE EQUAL
TO SUBSCRIPTION PRICE IN PRIVATE PLACEMENT
* MAXIMUM AMOUNT OF SUBSEQUENT OFFERING WOULD BE NOK 10
MILLION
Source text for Eikon: ID:nGNE9xjffY
Further company coverage: THIN.OL
(Gdansk Newsroom)
((gdansk.newsroom@thomsonreuters.com; +48 58 772 0920;))