Brief: Hua Yu Lien Development to issue 2018 1st tranche secured corporate bonds worth up to T$2 bln

HUA YU LIEN Development

10/05/2018 09:42

May 10 (Reuters) - Hua Yu Lien Development Co Ltd  1436.TW 
:

    * Says it plans to issue 2018 1st tranche secured corporate
bonds worth up to T$2 billion 
    * Bonds are each with par value of T$1 million , a term of 5
years 
    
    
    Source text in Chinese: https://goo.gl/e2Yn8Z
    Further company coverage:  1436.TW 

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