Brief: Hulic to issue hybrid bonds worth 50 bln yen
Jan 19 (Reuters) - Hulic Co Ltd 3003.T
* Says it will issue hybrid bonds worth 50 billion yen with
interest rate of 0.99 percent(during the period from Jan. 26,
2018 to Jan. 26, 2023)
* Maturity date on Jan. 26, 2053
* Payment date on Jan. 26, 2018
* Mizuho Securities Co., Ltd., Nomura Securities Co., Ltd.,
Daiwa
Securities Co.Ltd. and SMBC Nikko Securities Inc. will serve as
underwriters
Source text in Japanese:https://goo.gl/hJZTe2
Further company coverage: 3003.T
(Beijing Headline News)
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Reuters Messaging: Pingping.Li1@thomsonreuters.com@reuters.net))
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