June 22 (Reuters) - Humble Group AB HUMBLE.ST :
* HUMBLE CONTEMPLATES ISSUANCE OF SUBSEQUENT BONDS
* TO EXPLORE POSSIBILITY TO ISSUE SUBSEQUENT BONDS UNDER
COMPANY'S
EXISTING SENIOR SECURED BOND LOAN 2021/2025 WITH A TOTAL
FRAMEWORK AMOUNT OF SEK 1,500,000,000 OF WHICH SEK 1,200,000,000
IS OUTSTANDING
* ISSUE IS EXPECTED TO BE CARRIED OUT WITHIN NEAR FUTURE,
SUBJECT
TO MARKET CONDITIONS
Source text for Eikon: ID:nWkr3ccpc8
Further company coverage: HUMBLE.ST
(Gdansk Newsroom)
((gdansk.newsroom@thomsonreuters.com; +48 58 7696600;))