Brief: Winbond To Buy Machinery From Applied Materials For T$2.3 Bln

Lam Research

21/05/2026 10:41

May 21 (Reuters) - Winbond Electronics 2344.TW:

SAYS TO BUY MACHINERY, EQUIPMENT FROM APPLIED MATERIALS SOUTH EASTASIA FOR T$2.3 BILLION  ($72.94 million)

SAYS TO BUY MACHINERY, EQUIPMENT FROM LAM RESEARCH INTERNATIONAL FOR T$1.8 BILLION  ($57.08 million)

Source text: ID:nMOP8764Wr

Source text: ID:nMOPbmVHFj

Further company coverage: 2344.TW

($1 = 31.5320 Taiwan dollars)

 (Reporting by Hong Kong newsroom)

 ((donny.kwok@thomsonreuters.com; +852 3462 7745;))