Brief: Lightwave Logic Announces Publication Of U.S. Patent Application On New Invention
June 23 (Reuters) - Lightwave Logic Inc LWLG.O :
* LIGHTWAVE LOGIC ANNOUNCES PUBLICATION OF U.S. PATENT
APPLICATION
FOR BREAKTHROUGH CHIP-SCALE PACKAGING TECHNIQUE TO ENABLE
FOUNDRY-LEVEL PACKAGING OF POLYMER MODULATORS
Source text for Eikon: ID:nPn3v6Wd7a
Further company coverage: LWLG.O
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Lightwave Logic
See all newsBrief: Lightwave Logic Inc Files For Mixed Shelf Size Not Disclosed - SEC Filing
Brief: Lightwave Logic Inc Concluded Co's Previously Issued Financial Statements For Quarter Ended June 30, 2025 Should No Longer Be Relied Upon
Brief: Lightwave Logic Appoints Snizhana Quan As Principal Financial Officer
Brief: Lightwave Logic Reached Definitive Agreement To Extend Term Of CEO Yves Lemaitre
Brief: Lightwave Logic Inc Increase In Size Of Board From Eight Members To Nine Members, Effective September 4, 2024