Brief: Tung Kai Technology Engineering to issue third series domestic secured convertible corporate bonds of T$300 mln
May 11 (Reuters) - Tung Kai Technology Engineering
3018.TW :
* Says it to issue the third series domestic secured
convertible corporate bonds, worth up to T$300 million
* Says par value and issue price of T$100,000 for the bonds
* Says maturity period of three years for the bonds
* Says coupon rate is 0 percent
* Says proceeds to be used to repay bank loan and enrich
operating funds
Source text in Chinese: http://985.so/yJQR
Further company coverage: 3018.TW
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Keywords: TUNG KAI TECHNOLOGY ENGINEERING/BRIEF
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