Brief: Mingfa Group (International) Announces Proposed Issue Of US$176 MLN 22.0% Bonds Due 2020
01/06/2020 16:06
June 1 (Reuters) - Mingfa Group (International) Co Ltd
0846.HK :
* ANNOUNCES PROPOSED ISSUE OF US$176 MILLION 22.0% BONDS DUE
2020
* NET PROCEEDS FROM ISSUE OF BONDS WILL AMOUNT TO ABOUT
US$175
MILLION
Source text for Eikon: ID:nHKS3Bcqpk
Further company coverage: 0846.HK
(Reuters.Briefs@thomsonreuters.com)
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