Brief: Mold-Tek Packaging Approves Bonus Share Issue in Ratio of 1:1
26/08/2026 09:05
BRIEF-Mold-Tek Packaging Approves Bonus Share Issue in Ratio of 1:1 Aug 26 (Reuters) - Mold-Tek Packaging Ltd MOLT.NS:
APPROVES 1:1 BONUS SHARE ISSUE
Source text: ID:nBSE9flHR1
Further company coverage: MOLT.NS
((Reuters.Briefs@thomsonreuters.com;))
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