TSMC considers making advanced memory chips, The Information reports

NVIDIA

Today 15:39

Nov 6 (Reuters) - Taiwan Semiconductor Manufacturing Co 2330.TW is considering expanding into advanced memory chip production, in a move that would allow it to capture a larger share of the AI hardware market, The Information reported on Friday.
The company recently started charting plans for making a type of advanced memory chips called 3D DRAM at the request of Nvidia NVDA.O, its biggest customer, the report said, citing two people with direct knowledge of the matter.
TSMC and Nvidia did not immediately respond to Reuters' requests for comment.    
TSMC could opt to build new factories for advanced memory chips, but it was not clear when it plans to begin production, according to the report
The world's largest chip manufacturer is also exploring acquiring an existing plant and converting it for memory production, the report said, similar to Micron's MU.O move this year to buy a fab and convert it for DRAM output
DRAM, or dynamic random access memory, chips are used to store data temporarily in devices. 3D DRAM is a memory architecture that stacks memory cells vertically rather than in a single horizontal layer to boost capacity
The push is helmed by Hsu Kuo-chin, a vice president who oversees advanced packaging at TSMC, according to the report 
TSMC's potential move comes at a time when a severe, AI-driven shortage of memory chips has pushed up prices and sent chip designers scrambling to look for additional supply
If TSMC pushes into advanced memory, it will have to compete with companies such as Samsung Electronics 005930.KS, SK Hynix 000660.KS and Micron

 (Reporting by Deborah Sophia in Bengaluru; Editing by Shilpi Majumdar)
 ((DeborahMary.Sophia@thomsonreuters.com;))