Brief: Resonac: Announces Consortium With US And Japan Companies To Collaborate On Next-Gen Chip Packaging
08/07/2024 02:31
July 8 (Reuters) - Resonac Holdings Corp 4004.T :
* RESONAC - ANNOUNCES CONSORTIUM WITH US AND JAPAN COMPANIES
TO
COLLABORATE ON NEXT-GEN CHIP PACKAGING
* RESONAC - PARTNERS IN CONSORTIUM INCLUDE KLA AND TOKYO
OHKA
KOGYO
* RESONAC - BRINGING PACKAGING RESEARCH AND DEVELOPMENT
CLOSER TO
SILICON VALLEY DEVICE MAKERS WILL HELP ADVANCE THE TECHNOLOGY
Source text for Eikon: ID:
Further company coverage: 4004.T
(Reporting by Sam Nussey)
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