Brief: Resonac - Filed Patent Infringement Lawsuit Against Four Chinese Makers Of Photosensitive Films For Semiconductor Package Substrates And High-Density Electronic Circuit Boards
24/01/2024 02:43
Jan 24 (Reuters) - Resonac Holdings Corp 4004.T :
* RESONAC - FILED PATENT INFRINGEMENT LAWSUIT AGAINST FOUR
CHINESE
MAKERS OF PHOTOSENSITIVE FILMS FOR SEMICONDUCTOR PACKAGE
SUBSTRATES AND HIGH-DENSITY ELECTRONIC CIRCUIT BOARDS
* RESONAC - HUNAN INITIAL NEW MATERIALS, HUNAN HORI NEW
MATERIALS,
SHENZHEN SANXI ELECTRONIC CIRCUIT, AND SHENZHEN TAIWEI PRECISION
CIRCUIT ARE CO-DEFENDANTS IN THIS LAWSUIT
Source text: https://www.resonac.com/news/2024/01/24/2862.html
Further company coverage: 4004.T
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