Brief: Resonac: To Spend 5.2 Billion Yen To Increase Production Capacity Of Adhesive Film For Semiconductor Packaging By 60% By 2026
04/04/2023 06:45
April 4 (Reuters) - Resonac Holdings Corp 4004.T :
* RESONAC: TO SPEND 5.2 BILLION YEN TO INCREASE PRODUCTION
CAPACITY OF ADHESIVE FILM FOR SEMICONDUCTOR PACKAGING BY 60% BY
2026
Further company coverage: 4004.T
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