Japan's Resonac to open chip packaging R&D centre in US

Resonac Holdings

22/11/2023 03:56

By Sam Nussey
       TOKYO, Nov 22 (Reuters) - Japanese chip materials maker
Resonac  4004.T  said on Wednesday it will set up a research and
development centre for advanced  semiconductor packaging and
materials in Silicon Valley. 
    The packaging stage of production is increasingly being seen
as critical for driving advances in chip technology, with the
U.S. this week kicking off a $3 billion programme to boost its
packaging capabilities.
    Resonac, formerly Showa Denko, is a leading manufacturer of
materials for packaging such as films and plans to begin
operations at its new centre in 2025. 
    Japanese chip sector firms are seeking deeper ties with the
U.S. with foundry venture Rapidus planning to open a sales
office there by the end of the current financial year.

 (Reporting by Sam Nussey; Editing by Christopher Cushing)
 ((sam.nussey@tr.com))