South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment
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South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment SEOUL, Nov 12 (Reuters) - South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 005930.KS 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.
($1 = 1,339.5500 won)
(Reporting by Joyce Lee
Editing by Ed Davies)((joyce.lee@tr.com))
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