Brief: Shanghai Biren Technology Enters Placing Agreement For 130 Million H Shares
08/10/2026 08:54
BRIEF-Shanghai Biren Technology Enters Placing Agreement For 130 Million H Shares Oct 8 (Reuters) - Shanghai Biren Technology Co Ltd 6082.HK:
ENTERS PLACING AGREEMENT FOR 130 MILLION H SHARES AT HK$31.08 EACH
Further company coverage: 6082.HK
((Reuters.Briefs@thomsonreuters.com;))
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