Chinese chip firm Biren Tech seeks up to $838 million in Hong Kong placement, term sheet shows
Chinese chip firm Biren Tech seeks up to $838 million in Hong Kong placement, term sheet shows SINGAPORE, July 3 (Reuters) - Chinese fabless semiconductor design company, Shanghai Biren Technology 6082.HK, plans to raise about $801 million to $838 million through a new share placement in Hong Kong, according to a term sheet seen on Friday night.
(Reporting by Yantoultra Ngui, Editing by Louise Heavens)
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