Brief: Shanghai Fudan Microelectronics To Provide Funding For Integrated Circuit Innovation Centre
11/05/2026 14:23
May 11 (Reuters) - Shanghai Fudan Microelectronics Group Co Ltd 688385.SS: SAYS IT SIGNED COOPERATION AGREEMENT, PLANS TO PROVIDE UP TO 1 BILLION YUAN ($147.14 million) IN FUNDING TO JOINT INTEGRATED CIRCUIT INNOVATION CENTER Source text Further company coverage: 688385.SS ($1 = 6.7962 Chinese yuan renminbi) (Reporting by Beijing Newsroom) ((Xiuhao.Chen@thomsonreuters.com;))
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