Brief: Sharingtechnology to take out loan and issue corporate bonds

Sharingtechnology

14/12/2017 08:26

Dec 14 (Reuters) - Sharingtechnology Inc   3989.T  : 
       
    * Says it plans to take out a 5-yr term loan of 3.25 billion 
yen 
from banks on Dec. 15 
    * Co plans to issue the second series and the third series 
unsecured corporate bonds on Dec. 25, worth totaling 1 billion 
yen, to fulfill working capital  
 
     
    Source text in Japanese: https://goo.gl/EK6FKr 
    Further company coverage: 3989.T  
 
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