Brief: Sharingtechnology to take out loans of 300 mln yen and issue bonds worth 600 mln yen

Sharingtechnology

22/05/2018 07:48

May 22 (Reuters) - Sharingtechnology Inc  3989.T  
    
    * Says it will take out loans of 300 million yen in total
    * Says it will issue 5th series unsecured corporate bonds
worth
600 million yen and maturity date on May 30, 2023
    * Proceeds will be used for working capital 

    
    Source text in Japanese:https://goo.gl/LxF7aX
    Further company coverage: 3989.T 

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