Dec 5 (Reuters) - Sivers Semiconductors SIVEH.ST :
* SAID ON FRIDAY BUSINESS UNIT, SIVERS WIRELESS, SIGNED A
STRATEGIC DEVELOPMENT AGREEMENT WORTH $16.4 MILLION WITH A
EUROPEAN SATELLITE COMMUNICATIONS COMPANY
* AGREEMENT INCLUDES DEVELOPMENT OF SEVERAL CHIPSETS FOR
SATELLITE
COMMUNICATION GROUND TERMINALS
* THE LONG-TERM PARTNERSHIP IS EXPECTED TO LAST LONG PAST
2030
WITH SIVERS' CHIPS BEING USED IN A GROWING NUMBER OF TERMINALS
FROM 2023 AND BEYOND
* DEVELOPMENT ACTIVITIES FOR THIS AGREEMENT STARTED IN
AUGUST 2022
AND ARE PLANNED TO RUN THROUGH JULY 2024
* IT IS ESTIMATED THAT THE BULK OF THE WORK AND REVENUE WILL
BE
RECOGNIZED IN 2023
* THIS WORK IS EXPECTED TO BE FOLLOWED BY VOLUME
DEPLOYMENTS,
STARTING IN 2024 OR 2025 FOR THE SECOND-GENERATION TERMINALS
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Further company coverage: SIVEH.ST
(Gdansk Newsroom)
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