Brief: Tiangong International Enters Hk$79.3 Million Dividend Loan Facility Deal As Borrower
22/07/2026 18:11
BRIEF-Tiangong International Enters Hk$79.3 Million Dividend Loan Facility Deal As Borrower July 22 (Reuters) - Tiangong International Co Ltd 0826.HK:
AS BORROWER, ENTERS HK$79.3 MILLION DIVIDEND LOAN FACILITY DEAL ON JULY 22, 2026
Further company coverage: 0826.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Tiangong International
See all newsHK-listed Tiangong rises most in 4 months on securing European supply deal
Brief: Tiangong International Says Unit Enters Purchase Agreement With European Customer
China's space diplomacy lifts Pakistani astronaut toward orbit
Brief: Tiangong International Says Wu Suojun Resigns As Executive Director
China's Tiangong International's H1 revenue and profit rise, aided by price pass-through