Brief: Resonac: Announces Consortium With US And Japan Companies To Collaborate On Next-Gen Chip Packaging

TOKYO OHKA KOGYO

08/07/2024 02:31

July 8 (Reuters) - Resonac Holdings Corp  4004.T :
    * RESONAC - ANNOUNCES CONSORTIUM WITH US AND JAPAN COMPANIES
TO
COLLABORATE ON NEXT-GEN CHIP PACKAGING
    * RESONAC - PARTNERS IN CONSORTIUM INCLUDE KLA AND TOKYO
OHKA
KOGYO
    * RESONAC - BRINGING PACKAGING RESEARCH AND DEVELOPMENT
CLOSER TO
SILICON VALLEY DEVICE MAKERS WILL HELP ADVANCE THE TECHNOLOGY

Source text for Eikon:  ID: 
Further company coverage:  4004.T 

 (Reporting by Sam Nussey)