Brief: Topoint Technology To Raise Up To T$600 Mln Via Private Placement Sale Of Convertible Bonds
15/04/2026 08:33
TAIPEI, April 15 (Reuters) - Topoint Technology 8021.TW: TO RAISE UP TO T$600 MILLION ($19.0 MLN), OR 60 MILLION SHARES, VIA PRIVATE PLACEMENT SALE OF CONVERTIBLE BONDS ZHEN DING TECHNOLOGY 4958.TW WILL BUY UP TO 1.9 MILLION SHARES FROM TOPOINT TECHNOLOGY PRIVATE PLACEMENT SALE Source text: ID:nMOP5jSPZT ID:nMOP8jNH8 Further company coverage: 8021.TW (Reporting by Faith Hung) ((faith.hung@thomsonreuters.com;))
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