Brief: UMC Board Approves Plan To Raise Up To $1.8 Billion Via Overseas Unsecured Convertible Bonds
26/08/2026 07:43
BRIEF-UMC Board Approves Plan To Raise Up To $1.8 Billion Via Overseas Unsecured Convertible Bonds TAIPEI, Aug 26 (Reuters) - United Microelectronics Corp 2303.TW:
BOARD APPROVES PLAN TO RAISE UP TO $1.8 BILLION VIA OVERSEAS UNSECURED CONVERTIBLE BONDS
PROCEEDS FROM THE BOND SALE WOULD BE USED TO FUND PURCHASES OF MACHINERY EQUIPMENT, FACILITY ENGINEERING
Source text: ID:nMOP1KZtZx
Further company coverage: 2303.TW
(Reporting by Faith Hung)
((faith.hung@thomsonreuters.com;))
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