Brief: Valeo, Calyos Sign MoU To Develop Chip Cooling Solutions
09/06/2026 08:28
BRIEF-Valeo, Calyos Sign MoU To Develop Chip Cooling Solutions June 9 (Reuters) - Valeo SE VLOF.PA:
CO AND CALYOS HAVE SIGNED MEMORANDUM OF UNDERSTANDING (MOU) TO DEVELOP AND INDUSTRIALIZE HIGH-PERFORMANCE, STANDALONE CHIP COOLING SOLUTIONS
PARTNERSHIP TARGETS AMONG OTHERS AI-DRIVEN DATA CENTER CHIP AND RACK POWER INCREASES
Source text: https://tinyurl.com/yc3u3evt
Further company coverage: VLOF.PA
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