Brief: Winbond To Buy Machinery, Equipment From Lam Research For T$3.22 Bln
16/10/2026 11:15
BRIEF-Winbond To Buy Machinery, Equipment From Lam Research For T$3.22 Bln Oct 16 (Reuters) - Winbond Electronics Corporation 2344.TW:
CO TO BUY MACHINERY, EQUIPMENT FROM LAM RESEARCH INTERNATIONAL FOR T$3.22 BILLION ($99.50 million)
Source text: ID:nMOP1WGwXw
Further company coverage: 2344.TW
($1 = 32.3610 Taiwan dollars)
(Reporting by Hong Kong newsroom)
((donny.kwok@thomsonreuters.com; +852 3462 7745;))
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