Brief: Winbond To Buy Machinery From Applied Materials For T$2.3 Bln
May 21 (Reuters) - Winbond Electronics 2344.TW: SAYS TO BUY MACHINERY, EQUIPMENT FROM APPLIED MATERIALS SOUTH EASTASIA FOR T$2.3 BILLION ($72.94 million) SAYS TO BUY MACHINERY, EQUIPMENT FROM LAM RESEARCH INTERNATIONAL FOR T$1.8 BILLION ($57.08 million) Source text: ID:nMOP8764Wr Source text: ID:nMOPbmVHFj Further company coverage: 2344.TW ($1 = 31.5320 Taiwan dollars) (Reporting by Hong Kong newsroom) ((donny.kwok@thomsonreuters.com; +852 3462 7745;))
Recent news on Winbond Electronics
See all newsBrief: Chipmaker Winbond April Net Profit +21,608% Y/Y At T$7.49 Billion
Brief: Winbond Electronics Acquires Machinery Equipment For T$1.26 Billion
Brief: Winbond Electronics Acquires Machinery Equipment For T$1.23 Billion
Brief: Winbond To Buy Machinery From Applied Materials For T$2.3 Bln
Brief: Winbond Says January-March Net Profit At T$10.11 Bln