Brief: XTPL Files Motion To Us Patent Office Regarding Company's Technological Solution
Sept 19 (Reuters) - XTPL SA XTP.WA :
* FILES MOTION TO US PATENT OFFICE REGARDING TECHNOLOGICAL
SOLUTION FOR PRINTING ADVANCED THREE-DIMENSIONAL ELECTRONIC
CONNECTIONS WITH HIGH PACKING DENSITY
Source text for Eikon: ID:nEM8mJRTsa
Further company coverage: XTP.WA
(Gdansk Newsroom)
((gdansk.newsroom@thomsonreuters.com; +48 58 769 66 00;))
Recent news on XTPL SA
See all newsBrief: Xtpl Confirms Order For Upd Module From Japanese Industrial Electronics Manufacturer
Brief: XTPL Q1 Net Loss 5.9 Million Zlotys
Brief: XTPL FY Net Loss 23.3 Million Zlotys
Brief: XTPL Estimated Q1 2026 Consolidated Revenue At 1.2 Million PLN
Brief: XTPL To Sell 300,000 Series Y Shares At 65 Zlotys/Shr