Brief: XTPL Gets Patent For Bottom-Up Method For Forming Wire Structures Upon A Substrate
10/03/2023 07:32
March 10 (Reuters) - XTPL SA XTP.WA :
* GETS PATENT FOR BOTTOM-UP METHOD FOR FORMING WIRE
STRUCTURES
UPON A SUBSTRATE
* PATENT GRANTED BY MALAYSIAN PATENT OFFICE
Source text for Eikon: ID:nEM4r8mNGa
Further company coverage: XTP.WA
(Gdansk Newsroom)
((gdansk.newsroom@thomsonreuters.com;))
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