Brief: Yee Hop Says Units As Borrowers Confirmed Acceptance Of Facility Letter Issued By Bank
Feb 18 (Reuters) - Yee Hop Holdings Ltd 1662.HK :
* YH ENGINEERING,YH CONSTRUCTION CONFIRMED ACCEPTANCE OF
FACILITY
LETTER ISSUED BY BANK MAKING AVAILABLE FACILITY IN HK$20 MILLION
TO BOTH BORROWERS
* YH ENGINEERING AND YH CONSTRUCTION ACCEPTED FACILITY
LETTER BY
BANK TO AN AGGREGATE OF HK$250.61 MILLION TO YH ENGINEERING ONLY
Source text for Eikon: ID:nHKS75hjhM
Further company coverage: 1662.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Yee Hop Holdings
See all newsBrief: Yee Hop Says Yh Engineering, Yh Materials Confirmed Acceptance Of Facility Letter Issued By Bank
Brief: Yee Hop Holdings Says Trio AI Entered Collaboration Arrangement With HGC Global Communications
Brief: Yee Hop Says On 26 Nov Unit Entered Non-Legally Binding MoU
Brief: Yee Hop Says Chairman Purchased 1 Million Ordinary Shares
Brief: Yee Hop Holdings Expects Profit Of At Least HK$30.5 Mln For HY