Brief: Yee Hop Says Yh Engineering, Yh Materials Confirmed Acceptance Of Facility Letter Issued By Bank
BRIEF-Yee Hop Says Yh Engineering, Yh Materials Confirmed Acceptance Of Facility Letter Issued By Bank July 2 (Reuters) - Yee Hop Holdings Ltd 1662.HK:
YH ENGINEERING, YH MATERIALS CONFIRMED ACCEPTANCE OF FACILITY LETTER ISSUED BY BANK
FACILITY LETTER ISSUED BY BANK FOR AN AGGREGATED AMOUNT NOT EXCEEDING HK$75.0 MILLION.
Further company coverage: 1662.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Yee Hop Holdings
See all newsBrief: Yee Hop Says Yh Engineering, Yh Materials Confirmed Acceptance Of Facility Letter Issued By Bank
Brief: Yee Hop Holdings Says Trio AI Entered Collaboration Arrangement With HGC Global Communications
Brief: Yee Hop Says On 26 Nov Unit Entered Non-Legally Binding MoU
Brief: Yee Hop Says Chairman Purchased 1 Million Ordinary Shares
Brief: Yee Hop Holdings Expects Profit Of At Least HK$30.5 Mln For HY