Brief: Corentec receives patent
09/01/2018 03:42
Jan 9 (Reuters) - Corentec Co Ltd 104540.KQ :
* Says it receives patent named method for manufacturing
implant
having porous layer on surface thereof
Source text in Korean: https://goo.gl/YaBkhB
Further company coverage: 104540.KQ
(Beijing Headline News)
((Beijing.HeadlineNews@thomsonreuters.com; Reuters Messaging:
Yinglan.Ma@thomsonreuters.com@reuters.net))
Recent news on CORENTEC
See all newsBrief: Corentec Q4 Operating Profit 3 Billion Won, Up 39.7% From Year Earlier
Brief: Corentec Q3 Operating Profit 3.6 Billion Won, Up 221.4% From Year Earlier
Brief: Corentec Q1 Operating Profit 421 Million Won, Up 1440% From Year Earlier
Brief: Corentec Q1 Operating Profit 1.7 Billion Won, Up 366% From Year Earlier
Brief: Corentec Co Q4 Operating Profit 1.8 Billion Won, Up 81% From Year Earlier