Brief: Haosen FinTech Proposes Issuance Of HK$10 Million 8% Bonds Due 2028
March 25 (Reuters) - Haosen Fintech Group Ltd 3848.HK: PROPOSED ISSUANCE OF HK$10 MILLION 8% BONDS DUE 2028 Further company coverage: 3848.HK ((Reuters.Briefs@thomsonreuters.com;))
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