Brief: Haosen FinTech Proposes Issuance Of HK$20 Million 8% Bonds Due 2026
22/03/2024 13:58
March 22 (Reuters) - Haosen Fintech Group Ltd 3848.HK :
* PROPOSED ISSUANCE OF HK$20 MILLION 8% BONDS DUE 2026
Further company coverage: 3848.HK
((Reuters.Briefs@thomsonreuters.com;))
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