Brief: Hikari Tsushin to issue unsecured corporate bonds worth totaling 50 bln yen

Hikari Tsushin

16/03/2018 06:11

March 16 (Reuters) - Hikari Tsushin Inc  9435.T  
   
    * Says it plans to issue 17th series unsecured corporate
bonds
worth 10 billion yen, with interest rate of 0.39 percent per
annum and maturity date of March 23, 2023
    * Says it plans to issue 18th series unsecured corporate
bonds
worth 40 billion yen, with interest rate of 1.79 percent per
annum and maturity date of March 23, 2033
    * Payment date on March 23
    * Bonds will be used for repayment of bonds and loans, as
well as
working capital 

    Source text in Japanese: https://goo.gl/oCbM96
    Further company coverage: 9435.T 

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