Brief: Winbond Electronics Says Equipment Purchases Will Be Increased Above Originally Planned T$16 Billion
18/02/2025 08:12
Feb 18 (Reuters) - Winbond Electronics 2344.TW :
* SAYS EQUIPMENT PURCHASES FROM APPLIED MATERIALS, 3 OTHERS
WILL
BE INCREASED ABOVE ORIGINALLY PLANNED T$16 BILLION ($487.8 MLN)
* WINBOND SAYS OTHER THREE EQUIPMENT SUPPLIERS ARE APPLIED
MATERIAL SOUTH EAST ASIA, LAM RESEARCH INTERNATIONAL, TOKYO
ELECTRON, KOKUSAI ELECTRIC
* WINBOND SAYS INCREASED EQUIPMENT EXPENDITURE NECESSARY TO
MEET
MARKET DEMAND FOR ADVANCED AVAILABLE TECHNOLOGY
Source text: ID:nMOP5ZrbgH
Further company coverage: 2344.TW
(Reporting by Faith Hung)
((faith.hung@thomsonreuters.com;))
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