Brief: Radium Life Tech to issue 2017 1st tranche corporate bonds worth T$1 bln

Radium Life Tech Co

01/09/2017 07:58

Sept 1(Reuters) - Radium Life Tech Co Ltd  2547.TW  : 
     
    * Says it plans to issue 2017 1st tranche 5-year secured 
corporate bonds worth T$1 billion with coupon rate of 1.02 
percent  
       
     
    Source text in Chinese: https://goo.gl/TK1Zv7 
    Further company coverage:  2547.TW  
 
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