Brief: Radium Life Tech to issue 2017 2nd tranche corporate bonds worth T$500 mln

Radium Life Tech Co

13/11/2017 11:20

Nov 13 (Reuters) - Radium Life Tech Co Ltd  2547.TW  : 
       
    * Says it plans to issue 2017 2nd tranche 5-year secured 
corporate 
bonds worth T$500 million with coupon rate of 1.02 percent 
 
     
    Source text in Chinese: https://goo.gl/txaQ8r 
    Further company coverage: 2547.TW  
 
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