(Updates Micron, Intel, TSMC and GlobalFoundries)
Dec 10 (Reuters) - The U.S. Department of Commerce has
finalized a subsidy of more than $6.1 billion for Micron
Technology, marking one of the largest government awards to chip
companies under the U.S. CHIPS and Science Act.
Below is a list of the large awards made so far under the
CHIPS and Science Act:
POLAR SEMICONDUCTOR
Polar Semiconductor, owned by Sanken Electric 6707.T and
Allegro MicroSystems ALGM.O , said it would receive as much as
$123 million in direct funding. It plans to invest about $525
million over the next two years to double the production
capacity of its Bloomingdale, Minnesota facility.
TEXAS INSTRUMENTS TXN.O
Texas Instruments will receive as much as $1.6 billion in
direct funding to support the construction of three new domestic
facilities.
MICRON MU.O
The U.S. Department of Commerce has finalized a subsidy of
more than $6.1 billion for the memory chip maker to support the
construction of several domestic semiconductor facilities.
SAMSUNG 005930.KS
The South Korean electronics giant will be provided up to
$6.4 billion to expand its facilities in Texas under a
preliminary memorandum of terms signed in April.
TSMC 2330.TW
The U.S. Commerce Department finalized a $6.6 billion
government subsidy in November for Taiwan Semiconductor
Manufacturing Co's U.S. unit for semiconductor production in
Phoenix, Arizona.
INTEL INTC.O
The U.S. Commerce Department said in November it was
finalizing a $7.86 billion government subsidy for Intel, down
from $8.5 billion announced in March after the California-based
chips maker won a separate $3 billion award from the Pentagon.
GLOBALFOUNDRIES GFS.O
In November, the U.S. finalized a $1.5 billion government
subsidy for the world's third-largest contract chipmaker to
build a semiconductor production facility in Malta, New York and
expand existing operations there and in Burlington, Vermont.
MICROCHIP TECHNOLOGY MCHP.O
The company will get $162 million in government grants, it
was announced in January, allowing the company to triple
production of mature-node semiconductor chips and
microcontroller units at two U.S. factories.
(Reporting by Chris Sanders; Additional reporting by Yuvraj
Malik, Rishi Kant and Harshita Mary Varghese in Bengaluru;
Editing by David Gregorio, Sriraj Kalluvila, Anil D'Silva and
Shilpi Majumdar)
((Chris.Sanders@thomsonreuters.com; +1 202-558-8254; Reuters
Messaging: chris.sanders.reuters.com@reuters.net))